SPIE. Advanced Lithography
San Jose Convention Center
San Jose, California, United States
24 – 28 February 2019

Conference 10959
Metrology, Inspection, and Process Control for Microlithography XXXIII
1. Edge placement error measurement in lithography process with die to database algorithm

Paper 10959-12
Date: Monday 25 February 2019
Time: 5:00 PM – 5:20 PM
Author(s): Yoshishige Sato, NGR Inc. (Japan); Shang-Chieh Huang, NGR Inc. (Taiwan); Kotaro Maruyama, Yuichiro Yamazaki, NGR Inc. (Japan)

The control of edge placement error (EPE) is playing key role in the patterning of advanced technology node. In past instance, EPE between upper layer and under layer was measured by e-beam metrology system. In case of photoresist pattern, it is difficult to observe under layer pattern and difficult to measure EPE. This study provides the measurement method of EPE on photoresist layer resulting from variation of scanner tool condition by using Die to Database technology with large image size which include huge number of patterns.

2. E-beam inspection of single exposure EUV direct print of M2 layer of N10 node test vehicle
Paper 10959-16
Date: Tuesday 26 February 2019
Time: 9:20 AM – 9:40 AM
Author(s): Yuichiro Yamazaki, NGR Inc. (Japan); Sayantan Das, IMEC (Belgium); Ryo Shimoda, NGR Inc. (Japan); Sandip Halder, IMEC (Belgium); Shinji Mizutani, Kotaro Maruyama, NGR Inc. (Japan); Philippe Leray, IMEC (Belgium)